VIS provides One-Stop-Shop from front-end wafer manufacturing to back-end turnkey services with high quality and efficiency via VIS's dedicated turnkey engineering forces to assist OSAT for backend process setup and qualification.
The backend services includes
Front Side Metallization
Front Side Metallization
Chemical Plating
Back side Grinding and Metallization
Wafer Thinning by Taiko and non-Taiko process
Chemical Plating
Chip Probe
Test Programming
Production Management
GaN Back End
Chip Probe
Dicing & Wafer thinning
Package Assembly
WLCSP and RDL
Solder ball drop methodology
Backside coating film is available
Offer Cu RDL with and without PI
Backend Solution Provider
Backend solution evaluation for customization
Backend Phase in project handling
New process Join Development
Advantages
Real time information
Real time production information via VIS-Online
Effective production management review with OSATs
Supply Chain Management
Seamless planning and operation
management
Various supply chain solutions
Fast ramp-up cycle time
Capacity flexibility
Quality and Reliability
Integrated quality management
Sufficiency engineering support for troubleshooting and issue handling
